纳米医学与纳米技术杂志

抽象的

Warm checking test lithography

Steve Lenk

Major angles and cutting edge aftereffects of warm checking test lithography (t-SPL) are surveyed here. t-SPL is an arising direct-compose nanolithography technique with numerous remarkable properties which empower unique or improved nano-designing in application fields going from quantum advances to material science. Specifically, ultrafast and exceptionally confined warm preparing of surfaces can be accomplished through the sharp warmed tip in t-SPL to create high-goal designs. We research t-SPL as a methods for producing three kinds of material connection: expulsion, transformation, and expansion. Every one of these classes is delineated with measure boundaries and application models, just as their separate chances and difficulties. We will probably give an information base of t-SPL abilities and current constraints and to direct nanoengineers to the best-fitting methodology of t-SPL for their difficulties in nanofabrication or material science. Numerous expected utilizations of nanoscale alterations with warm tests actually hold on to be investigated, specifically when one can use the innately ultrahigh warming and cooling rates.